Integrated circuit package-in-package system with carrier interposer
US7659609B2 · kind B2 · utility
12Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2007 |
| Grant date | Feb 9, 2010 |
| Priority date | — |
| Expiry date | Apr 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package-in-package system includes: mounting an integrated circuit device over a package carrier; forming a subassembly including: providing an integrated circuit package system having a carrier interposer with an integrated circuit die thereover, and mounting a device under the carrier interposer; mounting the subassembly over the integrated circuit device; and encapsulating the subassembly and the integrated circuit device over the package carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.