Coating and developing apparatus, and coating and developing method
US7661894B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2006 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Jul 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing block S2 includes unit blocks, a BCT layer B3, COT layer B4 and TCT layer B5, for forming coating films, and further includes DEV layers B1, B2 layered with the unit blocks B3, B4, B5 and used as unit blocks for a developing process. Beside the unit blocks B1 to B5, a group G of transfer sections comprising transfer sections adapted to transfer each wafer W with each main arm A1 to A5 of the unit block B1 to B5 and hydrophobicity rendering units adapted to provide a hydrophobicity rendering process to the wafer W is provided. The wafer W is transferred by a transfer arm D between the transfer sections and the hydrophobicity rendering units. In this case, since it is not necessary to transfer the wafer W to the hydrophobicity rendering unit by using, for example, a main arm A4 of a COT layer B4, the load on the arm A4 can be reduced, thereby enhancing the carrying throughput.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.