Plasma processing method and plasma processing apparatus for performing accurate end point detection
US7662646B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2007 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Dec 11, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a plasma processing method, a correlation between substrate type data and optical data is obtained by using a multivariate analysis; substrate type data is obtained from optical data based on the correlation when initiating a plasma processing; and a substrate type is determined by using the obtained substrate type data. Further, a setting data set corresponding to the determined substrate type is selected from setting data sets, each for detecting a plasma processing end point of the plasma processing, each of the setting data sets being stored in advance in a data storage unit; an end point of the plasma processing is detected based on the selected setting data set; and the plasma processing is terminated at the detected end point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.