Methods for assessing alignments of substrates within deposition apparatuses; and methods for assessing thicknesses of deposited layers within deposition apparatuses
US7662649B2 · kind B2 · utility
2Cited by
30References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2006 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | May 21, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention includes deposition apparatuses having reflectors with rugged reflective surfaces configured to disperse light reflected therefrom, and/or having dispersers between lamps and a substrate. The invention also includes optical methods for utilization within a deposition apparatus for assessing the alignment of a substrate within the apparatus and/or for assessing the thickness of a layer of material deposited within the apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.