Die rearrangement package structure using layout process to form a compliant configuration
US7662667B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Dec 1, 2008 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Dec 1, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die rearrangement package structure is provided, which includes a die that having an active surface and a bottom surface, and a plurality of pads is disposed on the active surface; a package body is provided to cover a die and the active surface being exposed; a polymer material with at least one slit is provided to cover the active surface and the pads is exposed from said slits; one ends of a plurality of metal traces is electrically connected to each pads; a protective layer is provided to cover the active surface of the dies and each metal traces, and the other ends of the metal traces being exposed; a plurality of connecting elements is electrically connected other ends of the metal traces, the characterized in that: the package body is a B-stage material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.