Leveler compounds
US7662981B2 · kind B2 · utility
16Cited by
17References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2009 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Jan 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/423
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.