Patent · US Active

Assembly of thin die coreless package

US7666714B2 · kind B2 · utility

2Cited by

2References

4Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Daoqiang Lu · Chandler, US
Rajashree Baskaran · Seattle, US
Charan Gurumurthy · Gilbert, US

Key dates

Filing date	Dec 29, 2006
Grant date	Feb 23, 2010
Priority date	—
Expiry date	Apr 18, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/16152
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In one embodiment, a method comprises coupling a coreless substrate panel to a pressure cover plate of a carrier, applying flux to the coreless substrate panel, placing at least one die on the coreless substrate panel, reflowing solder onto the coreless substrate panel, defluxing the coreless substrate panel, underfilling the coreless substrate panel, and attaching at least one heat spreader to the coreless substrate panel.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.