Patent · US Active

Semiconductor device with conductive die attach material

US7667337B2 · kind B2 · utility

1Cited by

5References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Joachim Mahler · Regensburg, DE
Thomas Behrens · Madison, US
Stefan Landau · Usingen, DE
Eduard Knauer · Deuerling, DE
Rupert Fischer · Maxhütte-Haidhof, DE

Key dates

Filing date	Sep 20, 2007
Grant date	Feb 23, 2010
Priority date	—
Expiry date	Apr 25, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19043
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device includes a carrier such as a lead frame, a semiconductor die and an attachment member affixing the semiconductor die to the carrier. The attachment device includes an electrically conductive organic material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.