Rupert Fischer
6Patents
2h-index
15Co-inventors
40Inventor score
Filing activity: Jun 4, 2007 → Aug 5, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7868465B2 | Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier | Electricity | 14 | Active |
| US7727813B2 | Method for making a device including placing a semiconductor chip on a substrate | Electricity | 7 | Active |
| US8110906B2 | Semiconductor device including isolation layer | Electricity | 2 | Active |
| US9673170B2 | Batch process for connecting chips to a carrier | Electricity | 2 | Active |
| US7667337B2 | Semiconductor device with conductive die attach material | Electricity | 1 | Active |
| US8642408B2 | Semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.