Substrate polishing apparatus and substrate polishing method
US7670206B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2004 |
| Grant date | Mar 2, 2010 |
| Priority date | — |
| Expiry date | Feb 14, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.