Semiconductor device package with integrated heat spreader
US7671455B2 · kind B2 · utility
8Cited by
7References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 2, 2006 |
| Grant date | Mar 2, 2010 |
| Priority date | — |
| Expiry date | Mar 11, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi chip housing has a lead frame to which plural die are soldered. A heat spreader conductive cap encloses a volume containing the plural die or chips and is fixed to the periphery of the lead frame. The die may be silicon or GaN based MOSFETs or integrated circuits or a mixture thereof. The tops of the die are closely spaced from the interior of the cap and the volume is filled with a thermally conductive, electrically insulating plastic encapsulant. One die can be connected to the clip as well as the lead frame and the other may be an IC die insulated from the clip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.