Patent · US Active

Sawing method for a semiconductor element with a microelectromechanical system

US7674688B2 · kind B2 · utility

0Cited by
3References
17Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 20, 2008
Grant dateMar 9, 2010
Priority date—
Expiry dateMar 20, 2028

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81C2203/0118
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

A sawing method for a Micro Electro-Mechanical Systems (MEMS) semiconductor device, wherein a gum material is disposed between a wafer having at least one MEMS and a carrier, and the gum material is disposed around the MEMS. The wafer is sawed according to the position correspondingly above the gum material. Finally, the carrier and the gum material are removed. By disposing the gum material between the carrier and the wafer, the MEMS are protected, and the wafer and the MEMS can avoid the pollution of water and foreign material, so that the yield can be improved. Furthermore, the wafer is sawed from the backside till the gum material without sawing through the gum material, so that the carrier is not sawed. Therefore, the carrier can be reused, such that the cost is reduced.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.