Method for producing a buried N-doped semiconductor zone in a semiconductor body and semiconductor component
US7675108B2 · kind B2 · utility
4Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2005 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | Aug 11, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/157
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a buried n-doped semiconductor zone in a semiconductor body. In one embodiment, the method includes producing an oxygen concentration at least in the region to be doped in the semiconductor body. The semiconductor body is irradiated via one side with nondoping particles for producing defects in the region to be doped. A thermal process is carried out. The invention additionally relates to a semiconductor component with a field stop zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.