Manufacturing semiconductor circuit, corresponding semiconductor circuit, and associated design process

US7675173B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Walther Lutz · Erding, DE
• Erwin Ruderer · Borgo San Lazzaro, DE

Key dates

• Filing date: Oct 18, 2006
• Grant date: Mar 9, 2010
• Expiry date: Jun 14, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A process of manufacturing a semiconductor circuit includes providing a substrate layer, forming a metal layer above the substrate layer, incorporating circuit components in the substrate layer, and electrically connecting the circuit components to the metal layer. The process includes configuring the circuit components to perform an electrical function of the semiconductor circuit. The semiconductor circuit has a specific electrical conductivity between the substrate layer and the metal layer based on the electrical function performed. The process includes increasing the electrical conductivity between the substrate layer and the metal layer compared with the specific electrical conductivity.