Heating apparatus for semiconductor devices
US7675307B2 · kind B2 · utility
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10References
11Claims
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Assignee
Inventors
Key dates
| Filing date | Mar 18, 2008 |
| Grant date | Mar 9, 2010 |
| Priority date | — |
| Expiry date | May 16, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2875
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A heating apparatus for semiconductor devices comprises an oven including a front wall having a plurality of front openings and a back wall having a plurality of back openings each with isolating self-closing doors, a carrier module configured to load semiconductor devices into the oven through the front opening in a removable manner, a temperature-controlling module configured to control the temperature of the oven, and a test module positioned at a backside of the oven and configured to generate, receive or switch electrical test signals for the semiconductor devices in the oven.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.