Method for forming a circuit board via structure for high speed signaling
US7676919B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2006 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Jan 21, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a via in a printed circuit board is disclosed, which via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ground planes between the signal planes. The method comprises forming a first conductive layer on a first side of a circuit board, and forming a second conductive layer on a second side of the circuit board; forming a first hole in the first side of the circuit board; forming a first cylinder on vertical edges of the first hole and in contact with the first conductive layer; forming a second hole in the second side of the circuit board; forming a second cylinder on vertical edges of the first hole, wherein the second cylinder is surrounded by first cylinder and in contact with the second conductive layer; and forming a via in the circuit board, wherein the via is surrounded by the second cylinder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.