Inventor · Boise, ID, US

Houfei Chen

15Patents
5h-index
11Co-inventors
63Inventor score

Filing activity: May 30, 2002 → Dec 20, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US7149666B2 Methods for modeling interactions between massively coupled multiple vias in multilayered electronic packaging structures Physics 34 Expired
US8516695B2 Method for forming a circuit board via structure for high speed signaling Emerging Cross-Sectional Technologies 11 Active
US7676919B2 Method for forming a circuit board via structure for high speed signaling Emerging Cross-Sectional Technologies 9 Active
US7778039B2 Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise Emerging Cross-Sectional Technologies 5 Active
US7992297B2 Method for forming a circuit board via structure for high speed signaling Emerging Cross-Sectional Technologies 5 Active
US7633773B2 On-die anti-resonance structure for integrated circuit Electricity 5 Active
US7459638B2 Absorbing boundary for a multi-layer circuit board structure Electricity 3 Expired
US8243479B2 On-die anti-resonance structure for integrated circuit Electricity 1 Active
US8508950B2 Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise Emerging Cross-Sectional Technologies 1 Active
US8743555B2 Methods for suppressing power plane noise Emerging Cross-Sectional Technologies 1 Active
US8023293B2 On-die anti-resonance structure for integrated circuit Electricity 1 Active
US7660708B2 S-matrix technique for circuit simulation Physics 0 Active
US9622358B2 Method for forming a circuit board via structure for high speed signaling Emerging Cross-Sectional Technologies 0 Active
US12416964B2 Methods and apparatus for bi-directional control of computing unit frequency Emerging Cross-Sectional Technologies 0 Active
US9055702B2 Method for forming a circuit board via structure for high speed signaling Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.