Semiconductor package with redistributed pads
US7678609B2 · kind B2 · utility
8Cited by
3References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 3, 2006 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Mar 26, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T436/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a semiconductor package which includes coupling an electrode of a semiconductor device to a portion of a lead frame, overmolding at least a portion of the die, and then removing a portion of the die to obtain a desired thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.