Method and system for forming a thin film device
US7678626B2 · kind B2 · utility
3Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2005 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | May 17, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D99/00
Abstract
A method of forming a thin film device on a flexible substrate is disclosed. The method includes depositing an imprintable material over the flexible substrate. The imprintable are stamped material forming a three-dimensional pattern in the imprintable material. A sacrificial layer is formed over the three-dimensional pattern. A conductive layer is deposited over the sacrificial layer. The sacrificial layer is removed, leaving portions of the conductive layer as defined by the three-dimensional pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.