Energy beam treatment to improve packaging reliability
US7678713B2 · kind B2 · utility
3Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2005 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Apr 16, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76825
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a process for improving the hardness and/or modulus of elasticity of a dielectric layer and a method for manufacturing an integrated circuit. The process for improving the hardness and/or modulus of elasticity of a dielectric layer, among other steps, includes providing a dielectric layer having a hardness and a modulus of elasticity, and subjecting the dielectric layer to an energy beam, thereby causing the hardness or modulus of elasticity to increase in value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.