Wafer-level alignment of optical elements
US7680376B2 · kind B2 · utility
5Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2007 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Jun 29, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B27/62
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods are disclosed of fabricating an optical assembly. An active optical element is disposed near or on a first surface of a slab of optical material. A passive optical element is formed on a second surface of the slab, with the second surface being substantially parallel to the first surface. An optical axis of the passive optical element is aligned with an optical path between the passive optical element and an active region of the active optical element using a lithographic alignment process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.