Method and apparatus for placing an integrated circuit device within an integrated circuit layout
US7681164B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2007 |
| Grant date | Mar 16, 2010 |
| Priority date | — |
| Expiry date | Jun 4, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/392
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system that places an integrated circuit (IC) device within an IC chip layout is presented. During operation, the system receives the IC device to be placed within the IC chip layout, wherein the IC chip layout includes one or more continuous rows of diffusion. Next, the system places the IC device within a continuous row of diffusion. The system then determines whether the IC device is to be electrically isolated from other IC devices. If so, the system inserts one or more isolation devices within the continuous row of diffusion so that the IC device can be electrically isolated from other IC devices. The system then biases the one or more isolation device so that the IC device is electrically isolated from other IC devices within the continuous row of diffusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.