Patent · US Active

Method for fabricating a module including a sintered joint

US7682875B2 · kind B2 · utility

4Cited by

0References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Karsten Guth · Soest, DE
Ivan Nikitin · Regensburg, DE

Key dates

Filing date	May 28, 2008
Grant date	Mar 23, 2010
Priority date	—
Expiry date	May 28, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S977/777
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method comprises applying a paste comprising metal grains, a solvent, and a sintering inhibitor to one of a die and a metal layer. The method comprises evaporating the solvent in the paste and placing the one of the die and the metal layer on the other of the die and the metal layer such that the paste contacts the die and the metal layer. The method comprises applying a force to the one of the die and the metal layer and decomposing the sintering inhibitors to form a sintered joint joining the die to the metal layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.