Karsten Guth
17Patents
4h-index
20Co-inventors
52Inventor score
Filing activity: Jan 26, 2007 → Oct 12, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7555832B2 | Semiconductor chip attachment | Emerging Cross-Sectional Technologies | 4 | Active |
| US8209858B2 | Method for mounting electronic components on a support | Emerging Cross-Sectional Technologies | 4 | Active |
| US7682875B2 | Method for fabricating a module including a sintered joint | Emerging Cross-Sectional Technologies | 4 | Active |
| US8563364B2 | Method for producing a power semiconductor arrangement | Electricity | 4 | Active |
| US7793819B2 | Apparatus and method for connecting a component with a substrate | Emerging Cross-Sectional Technologies | 3 | Active |
| US8586420B2 | Power semiconductor arrangement and method for producing a power semiconductor arrangement | Electricity | 2 | Active |
| US7757390B2 | Method for production of a semiconductor component | Emerging Cross-Sectional Technologies | 1 | Active |
| US9768035B2 | Electronic module and method for producing an electronic module | Electricity | 1 | Active |
| US8104667B2 | Method for connecting a component with a substrate | Emerging Cross-Sectional Technologies | 1 | Active |
| US8691624B2 | Die fixing method and apparatus | Emerging Cross-Sectional Technologies | 0 | Active |
| US8439249B2 | Device and method for making a semiconductor device including bonding two bonding partners | Electricity | 0 | Active |
| US8603864B2 | Method of fabricating a semiconductor device | Electricity | 0 | Active |
| US8253233B2 | Module including a sintered joint bonding a semiconductor chip to a copper surface | Electricity | 0 | Active |
| US8415207B2 | Module including a sintered joint bonding a semiconductor chip to a copper surface | Electricity | 0 | Active |
| US9214442B2 | Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip | Electricity | 0 | Active |
| US7851334B2 | Apparatus and method for producing semiconductor modules | Electricity | 0 | Active |
| US8637379B2 | Device including a semiconductor chip and a carrier and fabrication method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.