Epitaxial semiconductor deposition methods and structures
US7682947B2 · kind B2 · utility
15Cited by
27References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2007 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Jul 22, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0262
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for depositing epitaxial films such as epitaxial Ge and SiGe films. During cooling from high temperature processing to lower deposition temperatures for Ge-containing layers, Si or Ge compounds are provided to the substrate. Smooth, thin, relatively defect-free Ge or SiGe layers result. Retrograded relaxed SiGe is also provided between a relaxed, high Ge-content seed layer and an overlying strained layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.