Patent · US Active

Module with a shielding and/or heat dissipating element

US7683460B2 · kind B2 · utility

51Cited by

11References

29Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ludwig Heitzer · Regensburg, DE
Christian Stumpfl · Wels, AT
Michael Bauer · Nittendorf, DE

Key dates

Filing date	Sep 22, 2006
Grant date	Mar 23, 2010
Priority date	—
Expiry date	Sep 22, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A module (100) comprises a component (10) and a shielding element (11), which is mounted on a main surface (12) of the component (10) and has a welding contact (13).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.