Lithographic apparatus and device manufacturing method
US7684009B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2006 |
| Grant date | Mar 23, 2010 |
| Priority date | — |
| Expiry date | Jul 3, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70983
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A lithographic apparatus and method in which an illumination system supplies a projection beam, a patterning system imparts to the beam a pattern in its cross section, and a projection system projects the patterned beam onto a target portion of a substrate. The projection system comprises an array of lenses spaced from the substrate such that each lens in the array focuses part of the patterned beam onto the substrate. A displacement system causes displacement between the lens array and the substrate. A particle detector detects particles on the substrate which are approaching the lens array. A free working distance control system increases the spacing between the lens array and the substrate in response to detection of a particle. The lens array is moved away from the substrate as the detected particle passes the lens array. Thus damage to the lens array can be avoided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.