Working shape prediction method, working requirement determination method, working method, working system, method of manufacturing semiconductor device, computer program, and computer program storage medium
US7686673B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2002 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Dec 31, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The relationship between polishing conditions constituting elements and the worked shape (amount of polishing) obtained by way of these polishing conditions is input beforehand into polishing condition determining mechanism along with the type of the object of polishing, and polishing conditions (invariable polishing conditions) that are used in common for the polishing of this object of polishing. The polishing condition determining mechanism determines the polishing conditions on the basis of these conditions. Specifically, the above-mentioned polishing conditions constituting elements are given in a time series, or combinations of the above-mentioned polishing conditions constituting elements are converted into variations in the swinging velocity of the polishing body, and the swinging velocity corresponding to the swinging position is determined. The polishing apparatus control mechanism input the polishing conditions determined by the polishing condition determining mechanism, and control the polishing apparatus so that these polishing conditions are realized. As a result, working conditions for obtaining a specified worked shape in a working apparatus can be simply and accura…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.