Mountable integrated circuit package-in-package system with adhesive spacing structures
US7687897B2 · kind B2 · utility
13Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2006 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Apr 11, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mountable integrated circuit package-in-package system is provided including mounting an adhesion spacer over an integrated circuit die and a package substrate, mounting an integrated circuit package system having an inner adhesion structure with the inner adhesion structure on the adhesion spacer, and forming a package encapsulation for covering the integrated circuit package system over the adhesion spacer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.