CMOS-compatible non-volatile memory cell with lateral inter-poly programming layer
US7688639B1 · kind B1 · utility
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9Claims
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Key dates
| Filing date | Oct 12, 2007 |
| Grant date | Mar 30, 2010 |
| Priority date | — |
| Expiry date | Oct 12, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C16/0466
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electrically erasable programmable read-only memory (“CMOS NON-VOLATILE MEMORY”) cell is fabricated using standard CMOS fabrication processes. First and second polysilicon gates are patterned over an active area of the cell between source and drain regions. Thermal oxide is grown on the polysilicon gates to provide an isolating layer. Silicon nitride is deposited between the first and second polysilicon gates to form a lateral programming layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.