Integrated circuit packaging system with stacked device and method of manufacturing thereof
US7691674B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2009 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Jun 20, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a first lead, having a first body and a first tip, and a paddle, having a protrusion at a side of the paddle, with the first body adjacent to the protrusion; forming a second lead having a second body and a second tip adjacent to the paddle; attaching a device, having a device active side, to the paddle and adjacent to the protrusion; mounting a component, having a component active side, to the device with the component active side facing the device active side and between the second body and the first tip; connecting the component and the second body; and forming an encapsulation covering the device, and partially covering the paddle, the component, the first lead, and the second lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.