Patent · US Active

Device including a housing for a semiconductor chip including leads extending into the housing

US7692283B2 · kind B2 · utility

2Cited by

4References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Holger Woerner · Regensburg, DE
Simon Jerebic · Regensburg, DE

Key dates

Filing date	Nov 12, 2007
Grant date	Apr 6, 2010
Priority date	—
Expiry date	Jan 4, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device including a housing for a semiconductor chip is disclosed. One embodiment provides a plurality of leads. A first lead forms an external contact element at a first housing side and extends at the first housing side into the housing in the direction of an opposite second housing side. The length of the first lead within the housing is greater than half the distance between the first and the second housing side.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.