Multi-detector defect detection system and a method for detecting defects
US7693323B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2002 |
| Grant date | Apr 6, 2010 |
| Priority date | — |
| Expiry date | Aug 25, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/95607
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for inspecting a substrate for defects, including: A method for inspecting a substrate for defects, the method including the steps of: (i) obtaining at least two wafer element detection signal; each wafer element detection signal reflects light scattered to a distinct direction; each wafer element detection signal having a wafer element detection value; (ii) calculating at least one wafer element attribute value in response to the at least two wafer element detection signals; retrieving at least one reference wafer element attribute value, each wafer element attribute value corresponding to a reference wafer element attribute value; and (iii) determining a relationship between the at least one reference wafer element attribute value, wafer element attribute value and at least one threshold to indicate a presence of a defect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.