Substrate processing apparatus
US7695233B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 30, 2006 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Jan 8, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68778
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The substrate processing apparatus is capable of highly efficiently feeding and carrying out work and improving production efficiency. The substrate processing apparatus comprises: a processing chamber including a processing stage; a first load lock chamber for feeding the work, the first load lock chamber being communicated to the processing chamber; a second load lock chamber for carrying out the work, the second load lock chamber being communicated to the processing chamber; a first buffer storage being located between the processing chamber and the first load lock chamber, the first buffer storage storing the work to be transferred therebetween; and a second buffer storage being located between the processing chamber and the second load lock chamber, the second buffer storage storing the work to be transferred therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.