Semiconductor devices and methods of manufacturing thereof
US7696019B2 · kind B2 · utility
6Cited by
5References
29Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 9, 2006 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Dec 6, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/0227
Abstract
Semiconductor devices and methods of manufacturing thereof are disclosed. A preferred embodiment includes a semiconductor device comprising a workpiece, the workpiece including a first region and a second region proximate the first region. A first material is disposed in the first region, and at least one region of a second material is disposed within the first material in the first region, the second material comprising a different material than the first material. The at least one region of the second material increases a first stress of the first region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.