Layered metal structure for interconnect element
US7696439B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 9, 2007 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | May 9, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49224
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A layered metal structure is provided in accordance with an aspect of the invention. The structure can be used, for example, to fabricate a conductive interconnect element for conductively interconnecting one or more microelectronic elements. The layered structure includes first and second metal layers each of which may include one or more of copper or aluminum, for example. An intervening layer, may include for example, chromium between the first and second metal layers, chromium being resistant to an etchant usable to pattern the first and second metal layers selectively to the intervening layer. An etchant such as cupric chloride, ferric chloride (FeCl3), a peroxysulfuric composition, or a persulfate composition may be used to pattern the first and second metal layers in such case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.