Semiconductor device having pillar-shaped terminal
US7696615B2 · kind B2 · utility
0Cited by
10References
15Claims
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Assignee
Inventors
Key dates
| Filing date | Jul 11, 2007 |
| Grant date | Apr 13, 2010 |
| Priority date | — |
| Expiry date | Jul 11, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device and a method of forming the same are provided. A semiconductor chip included in the semiconductor device includes a pillar-shaped terminal and a pad-shaped terminal in a terminal region. The pillar-shaped terminal is exposed at a first surface of a chip substrate in the terminal region and the pad-shaped terminal is exposed at a second surface of the chip substrate in the terminal region, where the first surface and the second surface of the chip substrate in the terminal region face oppositely from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.