Cluster tool substrate throughput optimization
US7699021B2 · kind B2 · utility
26Cited by
552References
8Claims
0Family size
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Key dates
| Filing date | Jan 30, 2006 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Mar 5, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history. In one embodiment, non-orthogonal robot trajectories are used to assure reliable and high speed substrate transfer. In another embodiment, at least one buffering station is used to avoid collision and improve throughput. In another embodiment, optimal positioning of the robots are used to improve throughput.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.