Method and zone for sealing between two microstructure substrates
US7700457B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2002 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Oct 9, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B7/0077
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The invention concerns a sealing zone between two microstructure substrates. Said sealing zone comprises at least the following parts: on a first wafer level (20), a lower edging (22A) made of an adhesive material capable of causing the first substrate (20) to adhere to a sealing material, said sealing material being adapted to spontaneously diffuse jointly with the material of the second wafer level (30); on said lower edging (22A), a layer of said sealing material; and on said layer of sealing material, a protuberance (36) formed on said second wafer level (30) containing a certain amount of sealing material. The invention is applicable to microstructures comprising vacuum-operated components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.