Integrated circuit and method of implementing a contact pad in an integrated circuit
US7701070B1 · kind B1 · utility
12Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2006 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Apr 24, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device is described. In particular, the integrated circuit comprises a substrate comprising active devices; a plurality of metal layers formed over the substrate, the plurality of metal layers being separated by insulating layers; a plurality of vias enabling connections to the active devices of the substrate; a contact pad support structure defining an opening in a metal layer of the plurality of metal layers and being coupled to an interconnect line; and a contact pad formed over the contact pad support structure. A method of implementing a contact pad in an integrated circuit is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.