Abu K. Eghan
3Patents
3h-index
4Co-inventors
39Inventor score
Filing activity: Jun 11, 2001 → Dec 4, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7061102B2 | High performance flipchip package that incorporates heat removal with minimal thermal mismatch | Electricity | 54 | Expired |
| US7064450B1 | Semiconductor die with high density offset-inline bond arrangement | Electricity | 24 | Expired |
| US7701070B1 | Integrated circuit and method of implementing a contact pad in an integrated circuit | Electricity | 12 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.