Electronic assembly and techniques for installing a heatsink in an electronic assembly
US7701720B2 · kind B2 · utility
2Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2007 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Apr 3, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53113
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.