Connection structure for semiconductor devices
US7705464B2 · kind B2 · utility
4Cited by
11References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2004 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Dec 15, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates generally to the manufacturing of semiconductor devices, and more particularly to an improved connection structure for semiconductor devices. A connection structure for a semiconductor device includes: a peanut-shaped opening comprising a narrow area and one or more wide areas, wherein the narrow area is between two of the one or more wide areas; and a conductive plug for filling at least partially the peanut-shaped opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.