Measuring and identifying analog characteristics of a microelectronic component at a wafer level and a platform level
US7705620B2 · kind B2 · utility
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3References
11Claims
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Key dates
| Filing date | Mar 29, 2006 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Nov 22, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/318511
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A die includes circuit components to perform normal operations and duplicated components of selective ones of the circuit components. Each end of the duplicated components is connected to a pad on the die to allow access by measurement devices. The measurement devices apply electricity to the pads to measure analog characteristics of the duplicated components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.