Predicting IC manufacturing yield based on hotspots
US7707526B2 · kind B2 · utility
10Cited by
1References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2007 |
| Grant date | Apr 27, 2010 |
| Priority date | — |
| Expiry date | Mar 26, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2111/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
One embodiment of the present invention provides a system that predicts a manufacturing yield of a chip. During operation, the system first receives a chip layout. Next, the system identifies hotspots within the chip layout, wherein a hotspot is a location within the chip layout wherein a yield-indicative variable value falls in a low manufacturable range. The system then obtains yield scores for the hotspots, wherein a yield score indicates a failure probability for a corresponding hotspot. Next, the system predicts the manufacturing yield for the chip based on the hotspots and the yield scores for the hotspots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.