Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
US7708618B2 · kind B2 · utility
0Cited by
46References
6Claims
0Family size
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Key dates
| Filing date | Oct 31, 2007 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Feb 4, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N21/426
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.