Semiconductor device and method of manufacturing the same
US7709315B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2007 |
| Grant date | May 4, 2010 |
| Priority date | — |
| Expiry date | Feb 23, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/037
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An interface between a bottom oxide film and a silicon nitride film in a neighborhood of a bottom part of a select gate is located at a position as high as or higher than that of an interface between a silicon substrate (p-type well) and a gate insulating film (d≧0) Further, the gate insulating film and the bottom oxide film are successively and smoothly jointed in the neighborhood of the bottom part of the select gate. By this configuration, localization in a distribution of electrons injected into the silicon nitride film in the writing is mitigated and electrons to be left unerased by hot-hole erasing are reduced. Therefore, not only the increase ratio of the electrons left unerased in the writing can be reduced, but also the problem in which the threshold voltage does not decrease to the predetermined voltage in the deletion can be suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.