Patent · US Active

Module with carrier element

US7709936B2 · kind B2 · utility

0Cited by

6References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Stephan Stoeckl · Schwandorf, DE

Key dates

Filing date	Dec 20, 2006
Grant date	May 4, 2010
Priority date	—
Expiry date	Dec 9, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a module comprising a carrier element having a lower stiffness or a different structure in a first region than in a second region, and also comprising a component applied to the carrier element. The component and the first region are connected to one another by a wire connection covered by a material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.