Method of manufacturing a probe card
US7716824B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 11, 2006 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Mar 23, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49218
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An object of the present invention is to finely conduct an inspection of high integration devices by making it possible to form guide holes in a support plate of a probe card in a narrower pitch than in the conventional case of forming the guide holes in a support plate of the same area, and to broaden a range of options for an elastic member which works to urge a probe pin. The present invention has a circuit board and a support plate being placed under the circuit board and supporting the probe pin. In the guide hole formed in the support plate, the probe pin composed of an elastic portion and a pin portion is inserted, and a rip of the pin portion protrudes downward from the support plate. The guide hole has a quadrangular horizontal sectional shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.