Electrostatic chuck having radial temperature control capability
US7718932B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 22, 2006 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Oct 18, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck (“chuck”) is provided for controlling a radial temperature profile across a substrate when exposed to a plasma. The chuck includes a number of independently controllable gas volumes that are each defined in a radial configuration relative to a top surface of the chuck upon which the substrate is to be supported. The chuck includes a support member and a base plate. The base plate positioned beneath and in a spaced apart relationship from the support member. The gas volumes are defined between the base plate and the support member, with separation provided by annularly-shaped thermally insulating dividers. Each gas volume can include a heat generation source. A gas pressure and heat generation within each gas volume can be controlled to influence thermal conduction through the chuck such that a prescribed radial temperature profile is achieved across the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.